(一) FR-4,FR-4.1,FR-5單面板及雙面板認證申請

(二) cem-1,cem-3單面板及雙面板申請

(三) FR-1,FR-3單面板及雙面板申請

(四) FR-4多層板申請

(五) 單面鋁基板僅燃燒認證和全認證申請

(六) 雙面鋁基板僅燃燒認證和全認證申請

(七) 多層鋁基板僅燃燒認證和全認證申請

(八) 銅基板 單面,雙面,多層 僅燃燒認證和全認證申請

(九) 柔性線路板(軟板)僅燃燒認證和全認證申請

(十) 軟硬結合板僅燃燒認證和全認證申請

(十 路板基材認證申請

(十二) 線路板油墨認證申請

(十三) 覆蓋膜,電磁膜,屏蔽膜認證申請

(十四) 已有UL,增加CUL認證申請

(十五) 其他認證申請

(十六) XPC板材 22f板材 HB板材 V0板材

1 Scope

1.1 These requirements apply to rigid printed-wiring boards and flexible printed-wiring board for use as components in devices or appliances. Compliance with these requirements does not indicate that the product is acceptable for use as a component of an end product without further investigation.

1.2 The flexible printed-wiring boards covered by these requirements consist of conductors affixed to insulating base film, with or without a cover-lay film, with midboard connections.

1.3 These requirements do not cover flexible printed-wiring boards of laminated-film construction in which the conductors are parallel to each other and are completely covered by the base film with only point-to-point end connections.

1.4 These requirements do not apply to flexible, flex-to-install, rigid, and multilayer rigid flex composite interconnect constructions with and without stiffener and adhesive materials as flexible materials interconnect constructions (FMIC's) for use as components in devices or appliances – that are covered by the Standard for Flexible Materials Interconnect Constructions, UL 796F.

Cover

Transmittal

Table of Contents

Body

INTRODUCTION

1 Scope

2 Glossary

3 Units of Measurement

4 Measurement Accuracy and Testing Conditions

5 Supplementary Test Procedures

6 References

7 General

CONSTRUCTION

8 General

9 Base Materials

10 Conductors

11 Adhesives for Conductor Bonding

12 Processes

13 Permanent Coatings

14 Plugged-Hole Materials

15 Embedded Components

16 Singlelayer (Singlesided and doublesided) Printed-Wiring Boards

17 Multilayer Printed-Wiring Boards

18 Metal Base Printed-Wiring Boards

19 Flexible Printed-Wiring Boards

20 Variations In Printed-Wiring Board Construction

PERFORMANCE

21 Test Samples

22 Data Collection

23 Microsection Analysis

24 Thermal Shock

25 Flammability

26 Bond Strength

27 Delamination and Blistering

28 Dissimilar Dielectric Materials Thermal Cycling Test

29 Plating Adhesion

30 Conductive Paste Adhesion Test

31 Dielectric Materials Intended for Use in Fabricating High Density Interconnect (HDI) Type Constructions

32 Silver Migration Test

MARKINGS

33 General

FOLLOW-UP INSPECTION

詳詢Sunny 陶 QQ1822971259